发明名称 |
METHOD FOR THERMAL CURING OF IMPLANTATION-DOPED SILICON CARBIDE SEMICONDUCTORS |
摘要 |
An implantation-doped silicon carbide conductor (10i) is thermally cured in a gas flow (12) supplying practically no carbon to said conductor (10i).In one advantageous embodiment, the container (13), carrier (16), radiation shields (4,5) and the base plate (17) are made of metal or a metal compound, e.g. tantalum or tantalum carbide, at least in the places which come into contact with the gas flow (12). |
申请公布号 |
WO9917345(A1) |
申请公布日期 |
1999.04.08 |
申请号 |
WO1998DE02722 |
申请日期 |
1998.09.14 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HOELZLEIN, KARLHEINZ;RUPP, ROLAND;WIEDENHOFER, ARNO |
发明人 |
HOELZLEIN, KARLHEINZ;RUPP, ROLAND;WIEDENHOFER, ARNO |
分类号 |
H01L21/265;C30B33/00;H01L21/04;H01L21/324 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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