| 摘要 |
<p>The invention concerns an electronic device with chip comprising film support including a film support with interface and at least a plane conducting interface, and a microcircuit connected to said interface. The invention is characterised in that the film support and the interface have such characteristics that they can be crumpled or folded together without deteriorating. It is further characterised in that it comprises a compensating film (22) arranged on said film support, said compensating film comprising a recess (21, 23) containing said microcircuit (4), its connections (7, 8) and a coating material (13). The invention also concerns a method for making the label.</p> |
