发明名称 Semiconductor device including an intrusion film layer
摘要 A semiconductor device including an insulation film superior in both planarization and water resistance is obtained. In this semiconductor device, a first insulation film including impurities is formed on a conductive layer. A film is formed between the first insulation film and the conductive layer for substantially preventing impurities from entering the conductive layer. Water resistance of the first insulation film is improved since impurities are included in the first insulation film. By using an insulation film superior in planarization as the first insulation film, a first insulation film superior in both planarization and water resistance can be obtained. The film provided between the first insulation film and the conductive layer prevents the impurities of the first insulation film from entering the conductive layer. Therefore, reduction in the reliability of the conductive layer can be prevented.
申请公布号 US5892269(A) 申请公布日期 1999.04.06
申请号 US19970806425 申请日期 1997.02.26
申请人 SANYO ELECTRIC CO., LTD. 发明人 INOUE, YASUNORI;MIZUHARA, HIDEKI
分类号 H01L21/265;H01L21/3105;H01L21/316;H01L21/768;H01L23/00;H01L23/522;H01L23/532;(IPC1-7):H01L23/58 主分类号 H01L21/265
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