| 摘要 |
PROBLEM TO BE SOLVED: To surely admit a plating liquid into the microgrooves on a substrate by allowing a substrate to be plated and a medium which is liquid at and under ordinary temp. and atm. pressure to coexist within a vessel and maintaining the inside of this vessel at a subcritical or supercitical state, then changing the medium to the ordinary temp. and atm. pressure without undergoing a gaseous phase state. SOLUTION: The liquid is introduced by liquid introducing piping 55 into a process chamber 53 in which the substrate 2 to be plated is housed and simultaneously air is discharged therefrom by gas discharge piping 57. After the process chamber 53 is filled with the liquid, a stop valve 23 is closed and the inside of the process chamber 53 is pressurized by a pump 74 to attain the critical pressure of∞22 MPa and thereafter the liquid temp. in the process chamber 53 is controlled to the critical temp. of >=374 deg.C by a temp. controller 78. The liquid and slight residual air in the process chamber 53 turn to uniform single phase fluid and the microgrooves on the substrate 2 to be plated are internally filled with the fluid mainly composed of a liquid component. The temp. in the process chamber 53 is thereafter lowered and the liquid is introduced from the piping 55 into the process chamber 53 to control the pressure therein, by which the fluid in the process chamber 53 is made into the liquid of the ordinary temp. and atm. pressure without evaporation.
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