| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject resin paste excellent in electroconductivity and heat dissipation property, and useful for the adhesion of a semiconductor to a metal frame, a ceramic base plate, etc., by including a silver coated aluminum powder, silver powder, resin component and organic peroxide. SOLUTION: This electroconductive resin paste is obtained by including (A) 10-90 wt.% silver coated aluminum powder having 5-60μm mean particle diameter, (B) 5-85 wt.% silver powder having 0.5-15μm mean particle diameter, (C) a resin component, 0.1-50 wt.% of which is an acrylic or a methacrylic resin expressed by formula I (R1 , R2 are each H or CH3 ) or formula II (R3 , R4 are each H or CH3 ) and (D) an organic peroxide (e.g.; 1,1,3,3-tetramethyl butylperoxy-2-ethylhexanoate) as indispensable components. Further, the ratio of the components (A)+(B) is 75-97 wt.%. In the resin paste, an additive such as another resin, various silane coupling agents, a pigment, etc., can be added as necessary.
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