发明名称 RESIN MOLDING METHOD AND MOLD FOR RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin molding method and a resin molding die thereof for absorbing properly the generation of sink marks and molding resin with high accuracy. SOLUTION: A cavity 8 is formed of molds 2 and 3, cavity pieces 4 and 5, a transfer face 6a of the cavity piece 6 and a transfer face 7a of the cavity piece 7 in an injection molding die 1, and molten resin 9 is filled from a resin introduction line into the cavity 8. Then the resin 9 is bonded on the transfer faces 6a and 7a of the transfer pieces 6 and 7, and then the resin 9 is cooled to lower than the softening temperature, and at that time, a filling material 12 is introduced between a part of the whole of a face on the side of a cavity 8 of the cavity piece 4 having no transfer face and the resin 9 in the cavity 8 through a filling material introduction line 11. When the filling material 12 is introduced between the cavity piece 4 and the resin 9, the cooling rate of the resin 9 on a section bonded with the filling material 12 is slower than those of other sections and movable more easily to absorb the shrinkage of resin 9 by cooling by the filling material 12 and also by a section whereon the resin 9 is brought into contact with the filling material 12 and improve the transfer accuracy.
申请公布号 JPH1190962(A) 申请公布日期 1999.04.06
申请号 JP19970276492 申请日期 1997.09.24
申请人 RICOH CO LTD 发明人 FURUKAWA RYUICHI;KANEMATSU TOSHIHIRO;SENOO SHINYA
分类号 B29C45/26;B29C45/56;B29C45/78;B29K105/04;(IPC1-7):B29C45/26 主分类号 B29C45/26
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