发明名称 RESIN COMPOSITION AND MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a molding material capable of giving a molded product of complex shape by the conventional molding method, i.e., a molding material excellent in moldability, and capable of giving a molded product free of molding defects, e.g. cracks, excellent in surface gloss, free of uneven gloss and good in outer appearance (beautiful outer appearance), and also to obtain a resin composition suitable for the above molding material. SOLUTION: This resin composition contains (A) a thermosetting resin, (B) a first peroxy compound having an alkyl group having a carbon number of 5 or more bound to a peroxide group, and (C) a second peroxy compound having a half-life temperature in 10 h at least 5 deg.C higher than that of the first peroxy compound and alkyl group having a carbon number of 5 or more bound to a peroxide group. This molding material contains the above composition. It is preferable that half-life temperature of the first peroxy compound in 1 h is within a range of±30 deg.C of molding temperature.
申请公布号 JPH1192668(A) 申请公布日期 1999.04.06
申请号 JP19970252478 申请日期 1997.09.17
申请人 NIPPON SHOKUBAI CO LTD 发明人 MINE KAZUYA;MASUI YASUHIRO;YAMAMOTO SHIGEHIRO
分类号 C08K5/14;C08L31/02;C08L33/04;C08L63/10;C08L67/06;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08K5/14
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