发明名称 BONDING OF SOLID LIGNOCELLULOSIC MATERIALS
摘要 <p>Consolidated or composite lignocellulosic products such as fiberboard, particle board, chipboard, waferboard, plywood, straw composites, etc. are formed by using a particulate binder or adhesive constituting particles of crude cellulose polysaccharide materials, e.g. wood flour or ground straw, coated with MDI or other isocyanate binder in a thickness preferably in the range of 1-7 νm.</p>
申请公布号 WO1999015601(A1) 申请公布日期 1999.04.01
申请号 US1998019289 申请日期 1998.09.17
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