METHOD OF MAKING A WIRING AND A CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE,申请号KR19950023919-传众专利搜索

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发明名称	METHOD OF MAKING A WIRING AND A CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
摘要
申请公布号	KR0174069(B1)	申请公布日期	1999.04.01
申请号	KR19950023919	申请日期	1995.08.03
申请人	NEC CORP.	发明人	KOYAMA, KUNIAKI
分类号	H01L23/522;H01L21/768;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/28	主分类号	H01L23/522
代理机构		代理人
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