发明名称 CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To reduce in size and weight an electric equipment by forming plastic resin simultaneously integrally with a board to form a socket body, mounting a socket contact electrically connected to an external connecting terminal in the body to electrically connect a circuit pattern to an electronic element, thereby mounting in high density. SOLUTION: The circuit board is formed of thermoplastic resin such as polysulfone or the like having satisfactory heat resistance. A socket body 2a of a socket 2 for a CRT is formed integrally with similar thermoplastic resin, and a socket contact 2b is embedded in the body 2a. Electronic elements such as a printed resistor 4, capacitor 5, transistor 6 and the like are mounted on a front surface of the board 1. A circuit pattern is formed on a rear surface of the board 1, and connected to the electronic elements such as the resistor 4 and the like of the front surface via a through hole 8. Accordingly, the socket and the board can be reduced in shape, and a mounting density can be enhanced.
申请公布号 JPH1187859(A) 申请公布日期 1999.03.30
申请号 JP19980140481 申请日期 1998.05.06
申请人 HOKURIKU ELECTRIC IND CO LTD 发明人 YOKOYAMA MITSURU;MACHINO MIKA;ARAKAWA OSAMU;NAKAGAWA TADASHI;TAKAYASU TATSUNORI;OBARA YOZO
分类号 B29C45/14;B29L31/34;H05K1/02;H05K1/11;H05K3/00;H05K3/20;(IPC1-7):H05K1/02 主分类号 B29C45/14
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