| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacture of a multilayered wiring board capable of raising the density of wiring, without the use of a special insulation material and without the need for large equipment investment. SOLUTION: In this manufacture, on the surface of an inner layer substrate 4 where an inner layer circuit 3 is formed, an insulating adhesive layer 2 and a conductor metallic foil 1 are laminated in the order, pressed, heated, and intergrated and an opening part 5 is formed at a part for forming an IVH (interstitial via hole) 9 for electrically connecting the conductor metallic foil 1 and the inner layer circuit 3. The method also includes a process for opening a non-through hole 11 by having the opening part 5 irradiated with a laser beam 6, applying a catalyst 7 for plating, forming a plating resist 8 on the surface of the conductor metallic foil 1 excluding the non-through hole 11 and the periphery, performing plating 13 at the part where the plating resist 8 is not formed, removing the plating resist 8, etching and removing the unwanted parts of the conductor metallic foil 1 and forming an outer layer wiring 10. |
