发明名称 TAB TAPE, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a TAB tape having two metal structure which can deal with fine pitch at low cost while stabilizing the manufacture. SOLUTION: The body has a first plane 3 principally provided with a wiring pattern, and a second plane 4 opposite to the first plane 3 composed of a base film 2 constituting the side provided with a thin metal film layer forming a ground layer. The base film 2 is provided with a device hole part 2a having a space part into which the end 1a of the wiring pattern formed on the first plane 3 projects. A ground electrode part 4a composed of the thin metal film layer forming a ground layer projects into the space part from a position on the second plane 4 corresponding to the projecting position of the wiring end part constituting the ground electrode from the base film part 2 in a predetermined wiring pattern formed on the first plane 3 projecting into the space part.
申请公布号 JPH1187434(A) 申请公布日期 1999.03.30
申请号 JP19970240703 申请日期 1997.09.05
申请人 NEC CORP 发明人 HONDA KOICHI
分类号 H01L21/60;H01L23/12;(IPC1-7):H01L21/60 主分类号 H01L21/60
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