发明名称 |
CONDUCTIVE ADHESIVE USEFUL FOR BONDING A SEMICONDUCTOR DIE TO A CONDUCTIVE SUPPORT BASE |
摘要 |
<p>A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: (a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; (c) at least one free radical initiator for polymericing said unsaturated monomer; and (d) finely divided silver particles.</p> |
申请公布号 |
KR0170415(B1) |
申请公布日期 |
1999.03.30 |
申请号 |
KR19920070902 |
申请日期 |
1992.04.18 |
申请人 |
ADVANCED PRODUCTS INC. |
发明人 |
CHEN, ANDREW;FRENTZEL, RICHARD L. |
分类号 |
C09J163/00;C08F283/10;C08F292/00;C08G59/00;C08G59/40;C08K3/08;C08L63/00;C09J151/08;C09J151/10;H01B1/22;H01L21/52;(IPC1-7):H01B1/02 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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