发明名称 SENSOR WITH DIAPHRAGM SENSOR CHIP
摘要 <p>An acceleration sensor with a diaphragm sensor chip (6) which includes a plurality of lead frames (3). One of the lead frames (3) has a die pad (4). The sensor chip (6) is elastically bonded with an adhesive (10) onto the die pad (4). The sensor chip (6) has a diaphragm (6b) and outputs a signal representing the flexure of the diaphragm (6b). The lead frames (3) are encapsulated with the molding material (2), with a space around the sensor chip (6). The molding material has a linear expansion coefficient of 1.4x10<-5>/ DEG C to 1.8x10<-5>/ DEG C and an elastic modulus of 100x10<3> kg/cm<2> to 130x10<3> kg/cm<2>. The use of such a molding material (2) decreases the rate of change of the temperature sensitivity of the acceleration sensor, thus providing an acceleration sensor with excellent temperature characteristics.</p>
申请公布号 WO9901771(A8) 申请公布日期 1999.03.25
申请号 WO1998JP02992 申请日期 1998.07.02
申请人 KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO;IWATA, HITOSHI;KANBE, MASAKATA 发明人 IWATA, HITOSHI;KANBE, MASAKATA
分类号 G01P21/00;G01P1/00;G01P1/02;G01P15/12;H01L23/29;H01L23/31;(IPC1-7):G01P15/12;G01L9/06;H01L29/84 主分类号 G01P21/00
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