发明名称 |
SENSOR WITH DIAPHRAGM SENSOR CHIP |
摘要 |
<p>An acceleration sensor with a diaphragm sensor chip (6) which includes a plurality of lead frames (3). One of the lead frames (3) has a die pad (4). The sensor chip (6) is elastically bonded with an adhesive (10) onto the die pad (4). The sensor chip (6) has a diaphragm (6b) and outputs a signal representing the flexure of the diaphragm (6b). The lead frames (3) are encapsulated with the molding material (2), with a space around the sensor chip (6). The molding material has a linear expansion coefficient of 1.4x10<-5>/ DEG C to 1.8x10<-5>/ DEG C and an elastic modulus of 100x10<3> kg/cm<2> to 130x10<3> kg/cm<2>. The use of such a molding material (2) decreases the rate of change of the temperature sensitivity of the acceleration sensor, thus providing an acceleration sensor with excellent temperature characteristics.</p> |
申请公布号 |
WO9901771(A8) |
申请公布日期 |
1999.03.25 |
申请号 |
WO1998JP02992 |
申请日期 |
1998.07.02 |
申请人 |
KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO;IWATA, HITOSHI;KANBE, MASAKATA |
发明人 |
IWATA, HITOSHI;KANBE, MASAKATA |
分类号 |
G01P21/00;G01P1/00;G01P1/02;G01P15/12;H01L23/29;H01L23/31;(IPC1-7):G01P15/12;G01L9/06;H01L29/84 |
主分类号 |
G01P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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