CARRIER PLATE FOR MICRO-HYBRID CIRCUITS

摘要

The invention relates to a carrier plate (2) for micro-hybrid circuits (7) with a ceramic body (3). According to the invention, the ceramic body (3) is porous and the cavities of said body are filled in with aluminum. A very good thermal binding of the micro hybrid circuits (7) onto the carrier plate (2) is possible due to the relatively small variances in the thermal recess coefficients of the carrier plate (2) and micro-hybrid circuit (7).