Verfahren zum Drahtbonden über einem aktiven Gebiet eines integrierten Bauelements
摘要
<p>Wire bonding over the active circuit (13) of an integrated circuit device (10) is accomplished by providing a layer of a polyimide material (23) in overlying relationship relative to the active circuit, depositing a bonding pad (31) on the polyimide layer opposite the active circuit, connecting the bonding pad electrically to the active circuit, and bonding a wire (33) to the bonding pad. <IMAGE></p>
申请公布号
DE69323515(D1)
申请公布日期
1999.03.25
申请号
DE1993623515
申请日期
1993.09.10
申请人
TEXAS INSTRUMENTS INC., DALLAS, TEX., US
发明人
HEINEN, KATHERINE G., DALLAS, TEXAS 75230, US;ALFARO, RAFAEL VERITY INSTRUMENTS INC., CARROLLTON TEXAS 75006, US;STIERMAN, ROGER J., DALLAS, TEXAS 75248, US