发明名称 |
Semiconductor device package having inner leads with slots |
摘要 |
A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.
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申请公布号 |
US5886405(A) |
申请公布日期 |
1999.03.23 |
申请号 |
US19970906877 |
申请日期 |
1997.08.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, TAE HYEONG;PARK, TAE SUNG;CHO, IN SIK;CHOI, HEE KOOK |
分类号 |
H01L23/28;H01L21/56;H01L23/495;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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