发明名称 METHOD AND DEVICE FOR CUTTING LEAD FRAME
摘要 <p>PROBLEM TO BE SOLVED: To reduce sticking of dross to a lead or the like by emitting a laser beam to a cutting part, providing in the center an opening for injecting an assist gas and preparing the injecting ports of the gas around the opening. SOLUTION: The lead frame cutting device is such that the cutting nozzle 5 has a nozzle opening 18 through which a laser beam 2 from a laser generator is emitted to the tie-bar 12 of the lead frame 9 and through which an assist gas is also injected, that blow-off ports 19 are provided in addition to and around the opening 18, and that a lower auxiliary nozzle 15 is further installed which injects the assist gas to the opposite side of the cutting nozzle 5 through the lead frame 9. As a result, the flow of the assist gas is uniformized in cutting the tie-bar 12.</p>
申请公布号 JPH1177357(A) 申请公布日期 1999.03.23
申请号 JP19970245232 申请日期 1997.09.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWATSU AKINOBU
分类号 B23K26/06;B23K26/14;H01L23/50;(IPC1-7):B23K26/06 主分类号 B23K26/06
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