DECOMPOSING METHOD OF ORGANIC FLUORINE BASED WASTE GAS AND DECOMPOSING DEVICE

摘要

PROBLEM TO BE SOLVED: To decompose an organic fluorine based waste gas discharged from a semiconductor production device at a high decomposition rate by decomposing in the presence of a decomposition accelerator under a specific evacuating state with a low temp. plasma of high frequency induction coupling system, which is specified in the frequency. SOLUTION: In the semiconductor production technique using a reduced pressure, which is typical in the semiconductor industry, such as vacuum CVD method, thermal CVD method, plasma CVD method, optical CVD method, plasma etching method, ion plantation method and the like, the organic fluorine based waste gas discharged from the various kinds of the devices is decomposed in the presence of the decomposition accelerating agent under the pressure of 0.01-30 Torr with the low tamp plasma of the high frequency induction coupling system having 1-100 MHz frequency. By using the decomposition accelerating agent to the gas to be treated, the organic fluorine based waste gas such as tetra fluoromethane, hexafluoroethane, dichlorodifluoromethane, dichlorotetrafluoroethane, monochlorodifluoroethane, trifluoromethane, trifluoroethane, which is conventionally difficult to be decomposed by a low temp. plasma of the high frequency induction coupling system, is decomposed at a high decomposition rate. And the discharge quantity of the waste gas to the air is reduced by decomposing the waste gas into a property capable of easily making harmless to contribute the maintenance of global environment.