| 摘要 |
PROBLEM TO BE SOLVED: To decrease the number of stages and to obtain high throughput at the time of forming a resist film over the entire part of the surface of an LCD substrate (glass substrate) and removing the unnecessary resist film at the edge of the substrate. SOLUTION: After the resist film is formed over the entire part of the surface of the LCD substrate 1 by spin coating and thereafter the substrate 1 is received by a transporting arm 32 from a coating film forming section 2, the substrate 1 is transported in an X direction along an X rail 31. At this time, the side edges disposed on both sides of the transporting path of the substrate 1 guide both edges and both front and rear surfaces of the substrate by guide parts 51 and both surface guide parts 52. The unnecessary resist film at the edges on the long sides of the substrate 1 is removed by a solvent in a first coating film removing section 40. The substrate 1 is then transported in a Y direction along a transporting Y-rail 3 and the unnecessary resist film at the edges on the short side of the substrate 1 is removed by the solvent in a second coating film removing section 60. |
