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发明名称
HIGH HEAT RELEASE PACKAGE HAVING HEAT SINK FOR PROTECTING BONDING WIRE
摘要
申请公布号
KR0182505(B1)
申请公布日期
1999.03.20
申请号
KR19950051326
申请日期
1995.12.18
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KYE, DONG-WAN;PARK, NAN-KYU;KWON, YONG-AHN;LEE, JAE-WON
分类号
H01L23/36;(IPC1-7):H01L23/36
主分类号
H01L23/36
代理机构
代理人
主权项
地址
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