Resin-sealed semiconductor device and method of manufacturing the device

摘要

A resin-sealed semiconductor device according to this invention is an LOC type semiconductor device comprising a semiconductor chip (3) having a circuit surface on which an electrode is formed; a lead (1) which is arranged in such a manner that the distal end of the lead overlaps the semiconductor chip, and which is electrically connected to each electrode; a lead fixing resin layer (9) interposed between the semiconductor chip and the lead to fix them; and a sealing resin layer (2) coated to cover the semiconductor chip and the lead. The diameter of filler contained in the lead fixing resin layer is about 1/10 to 1/5 the diameter of filler contained in the sealing resin layer, and is about 1/10 a gap between the lead and the semiconductor chip.