发明名称 |
Scanning system for inspecting anomalies on surfaces |
摘要 |
A high sensitivity and high throughput surface inspection system directs a focused beam of light at a grazing angle towards the surface to be inspected. Relative motion is caused between the beam and the surface so that the beam scans a scan path covering substantially the entire surface and light scattered along the path is collected for detecting anamolies. The scan path comprises a plurality of arrays of straight scan path segments. The focused beam of light illuminates an area of the surface between 5-15 microns in width and this system is capable of inspecting in excess of about 40 wafers per hour for 150 millimeter diameter wafers (6-inch wafers), in excess of about 20 wafers per hour for 200 millimeter diameter wafers (8-inch wafers) and in excess of about 10 wafers per hour for 300 millimeter diameter wafers (12-inch wafers).
|
申请公布号 |
US5883710(A) |
申请公布日期 |
1999.03.16 |
申请号 |
US19950499995 |
申请日期 |
1995.07.10 |
申请人 |
KLA-TENCOR CORPORATION |
发明人 |
NIKOONAHAD, MEHRDAD;STOKOWSKI, STANLEY E. |
分类号 |
G01N21/94;G01N21/95;G01N21/956;(IPC1-7):G01N21/00 |
主分类号 |
G01N21/94 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|