| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device to easily facilitate package assembly and wafer probing, and achieve a pad pitch of 40 μm or less. SOLUTION: In this device, the first pad p1, having both a pad 4 for an assembly and a pad 5 for a probe, and the second pad p2, having a connection part of a predetermined distance between the pad 4 and the pad 5 are arranged in alternating series. In the first pad P1, openings 2 exposing the pad 4 and the pad 5 to the protection film is formed, and a width in the opening 2 narrows gradually at predetermined positions along the direction S of the probe for the probe card sliding. In the second pad p2, the multiple openings 2 expose the pad 4 and the pad 5 to the protection film, and the width in the opening 2 of pad 5 contained in the opening 2 narrows gradually at predetermined positions along the directions of the probe for the probe card sliding. |
