摘要 |
Thermoplastic molding materials contain A) from 4 to 95% by weight of a semicrystalline, partly aromatic copolyamide composed of a1) from 30 to 44 mol % of units which are derived from terephthalic acid, a2) from 6 to 20 mol % of units which are derived from isophthalic acid, a3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and a4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a1) to a4) together giving 100%, and B) from 4 to 95% by weight of a polyolefin homo- or copolymer or a mixture thereof, C) from 1 to 20% by weight of a compatibilizer, D) from 0 to 20% by weight of an elastomeric polymer, E) from 0 to 50% by weight of a fibrous or particulate filler and F) from 0 to 30% by weight of conventional additives and processing assistants, the percentages by weight of components A to F together giving 100%.
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