| 摘要 |
PROBLEM TO BE SOLVED: To obtain a lead frame generally serviceable regardless of the chip size and the semiconductor package using the same, by providing a dam bar between inner leads and outer leads. SOLUTION: Tie bars 2A are extention-formed from the edge part of a lead frame 1a to the central part thereof. A die pad 4 is connected to the tie bars 2a to be supported while a chip 4 is fitted on the upper side. Besides, a plurality of inner leads 6 positioned around the die pad 4 are to be electrically connected to the bonding pads of the chip mounted on the die pad 4 in the wire-bonding time. On the other hand, outer leads 7 are respectively connected to the inner leads 6 to be externally exposed in the molding time. A dam bar 8 is formed between the inner leads 6 and the outer leads 7. In such a constitution, within this lead frame 1a, the inner leads 6, tie bars 2a and die pad 4 are formed on the same plane. |
