| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition excellent in ordinary temperature storability, moldability and soldering stress resistance by using a phenol/alkylaldehyde resin as the resin curing agent and using a latent cure accelerator. SOLUTION: This composition essentially consists of a crystalline epoxy resin (A) having a melting point of 50-150 deg.C, a resin curing agent (B) containing 30-100 wt.%, based on the resin curing agent, a phenol/alkylaldehyde resin of formula I (wherein m is 2-7; and n is 0-10), a cure accelerator (C) of formula II (wherein R<1> is phenyl or naphthyl) and an inorganic filler (D). The phenol/ alkylaldehyde resin has a hydroxyl equivalent of 100-200 g/eq., a softening point of 60-110 deg.C and a solution viscosity at 25 deg.C of 20-90μm<2> /s. The mixing ratio is such that the equivalent ratio of the epoxy groups of component A to the phenolic hydroxyl groups of component B is 0.5-2, component C is present in an amount of 0.4-20 pts.wt. per 100 pts.wt. components A and B, and component D is present in an amount of 200-2,400 pts.wt. per 100 pts.wt. components A and B.
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