| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a semiconductor element to be normally and stably operated for a long period, by preventing the entrance of moisture through the joints of surface wiring conductors composed of metal foil and an insulating substrate. SOLUTION: A wiring board is constituted by fixing surface wiring conductors 3a and 3b, which is electrically connected to inner wiring conductors 2 and composed of metal foil, to the surface of an insulating substrate 1 in which the internal wiring conductors 2 which are formed by coupling organic insulator powder with bismaleimidetriazine resin and contain metal powder coupled with each other with a thermosetting resin through epoxy resin adhesive layers 6a.6b. The bonding between the insulating substrate 1 and surface wiring conductors 3a and 3b is improved and, at the same time, the entrance of moisture through the joints between the substrate 1 and conductors 3a and 3b can be prevented effectively. Therefore, the electrical connection between the conductors 3a and 3b and the inner wiring conductors 2 can be maintained surely for a long period.</p> |
