| 摘要 |
PROBLEM TO BE SOLVED: To control manufacturing by a tape carrier itself. SOLUTION: An integrated manufacturing device for COB (chip-on-board package)Ics.has a loading device 2, a chip bonding device 3, an information display device 4, a curing device 5, a wire bonding device 6, a buffer 7, a transfer molding device 40, a residue removing device 8, and an unloading device 9. These devices are arranged in series. The information display device 4 displays a start display hole 71 for displaying the start, an end display hole 79 for displaying end, a change display hole 78 for displaying the changes of kinds or materials and the lot, a defect display hole 72 for displaying defects, a pitch display hole 73 for displaying pitch, and a joint display hole 76 for displaying a joint 75 by adhesive tapes of a tape carrier 11. Thus, the holding of the joint in molding a forming block by the detection of the joint display hole can be prevented at the time of formation, and the leaking of resin can be avoided.
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