发明名称 |
Thermally enhanced flip chip package |
摘要 |
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages. |
申请公布号 |
US5883430(A) |
申请公布日期 |
1999.03.16 |
申请号 |
US19970842417 |
申请日期 |
1997.04.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOHNSON, ERIC ARTHUR |
分类号 |
H01L23/12;H01L21/60;H01L23/31;H01L23/433;(IPC1-7):H01L23/10;H01L23/34;H01L23/48;H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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