发明名称 POWER ELECTRONICS MODULE AND POWER ELECTRONICS DEVICE EQUIPPING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a power electronics module in which both a pressurizing device and a cooling part are improved in modularity and size-reduction. SOLUTION: This power electronics module comprises two basic modules 1, and each basic module comprises at least one power electronics part 5 has at least one contact surface 6 which is attached to one metal surface 7 of a substrate 8, control connection parts 9, 14, and 20 for connecting the part 5 to a control module, power connection parts 11, 13, and 20 for power transmission between parts 5 and/or to the other basic module 1, and at least one metal heat exchanger 2 for discharging dissipation power from Joule effect of the power electronics part 5. Here, the metal heat exchanger 2 is attached to other metal surface 12 of the substrate 8.
申请公布号 JPH1167999(A) 申请公布日期 1999.03.09
申请号 JP19980173701 申请日期 1998.06.19
申请人 ALCATEL ALSTHOM CO GENERAL ELECTRICITE 发明人 RANCHY ERIC;PETITBON ALAIN
分类号 H01L23/473;H01L25/07;(IPC1-7):H01L23/473 主分类号 H01L23/473
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