| 摘要 |
PROBLEM TO BE SOLVED: To obtain a power semiconductor module which prevents a dislocation due to the manufacturing size error of a wiring board by a method wherein the wiring board is positioned in a self-aligned manner on a metal base by using the inside wall of a resin part in a board housing part as a reference. SOLUTION: A wiring board 5a to which connecting terminals 10b are soldered in advance is positioned in such a way that a solder sheet 21 is spread on a metal base 1b in a wiring-board housing part 82 and that protrusions 92 are used as the self-alignment means of the wiring board 5a, and the wiring board 5a is set on the solder sheet 21. In addition, a jig 65 is inserted into control terminals 4b and the connecting terminals 10b which are erected vertically at the inside of a case 6b, and the case 6b and the connecting terminals 10b are positioned while the control terminals 4b which are fixed by a resin are used as a reference. A stand 66 which is installed at the jig 65 is placed on the wiring board 5a as a weight, it is possible to prevent a dislocation due to the manufacturing size error of the wiring board 5a, and the wetting spread of solder 21 can be mode good. |
