| 摘要 |
<p>PROBLEM TO BE SOLVED: To secure an electrical conduction between a lead and a conductive ball, when bonding a chip on the lead of a film carrier on a pad of a mother board through the conductive ball. SOLUTION: An opening 9 of a film carrier 1, formed for exposing a lead 3 is filled with a conductive paste 23. On the surface 'a' which is now in the recessed shape after the conductive paste 23 has hardened, a conductive ball 20a is mounted. When the entire body is heated in a heating furnace, the conductive ball 20a is adhered to the conductive paste 23 and becomes a bump 20b. On the other hand, cream solder is applied onto a pad of a motherboard, and then the bump 20b is mounted on the cream solder and heated. Then, the bump 20b is adhered to the cream solder, and a chip 4 is bonded to the mother board through the film carrier 1.</p> |
