| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a wiring substrate involving wiring of low resistance and compactness, and a through hole with a high fill factor by suppressing expansion or shrinkage of conductive paste, and completely-removing organic matter in a substrate at the time of manufacturing a ceramics wiring substrate having copper wiring as a result of a green sheet and the conductive paste being sintered simultaneously. SOLUTION: A ceramics wiring substrate is obtained by printing conductive paste whose zirconium oxide of 0.5 to 7 pts.wt. is blended with conductor formation element of 100 pts.wt. in some cases, including 10 wt.% or lower amount of one type or two types or more of Ni, Cu, Pd, Pt, and Au with copper oxide taken as a main composition, to the surface of a green sheet and a through hole, layering it, heating it in the atmosphere for a debinder processing, heating it in reducing atmosphere to deoxidizing the copper oxide to metal copper, and firing it in nonoxidizing atmosphere. |
