| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding device which appropriately injects mold resin into a die and appropriately seals a semiconductor device with the mold resin. SOLUTION: In a molding device 10, an unmolded semiconductor device is set in a cavity 13 of a lower die 12, then an upper metal mold 11 and the lower die 12 are clamped. In this state, mold resin 17 is injected from a gate 16 into the cavity 13. Upon injection of the mold resin 17 into the cavity 13, an ultrasonic-wave vibrator 14 attached to the upper die 11 and an ultrasonic- wave vibrator 15 attached to the lower die 12 are electrified. The ultrasonic- wave vibrators 14 and 15 makes the upper and lower dies 11 and 12 vibrate by ultrasonic waves, so as to smooth the flow of the mold resin 17. As a result, the mold resin 17 is efficiently and appropriately injected into the cavity 13, to suppress the occurrence of unfilled portion or voids, and improve the injection efficiency of the mold resin 17 and the molding performance. |
