| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of packaging an electronic component capable of accurately setting an angle of an electronic component vacuum suched by a nozzle, improving a packaging accuracy, shortening a tact time, and packaging at a high speed. SOLUTION: While an electronic component 30 of a parts feeder is vacuum suched and picked up by a lower end section of a nozzle 22, and transferred to a recognition device, the electronic component 30 is turned at a large angle and a packaging angle is set. The electronic component 30 is mounted on the substrate 3 by detecting a positioning deviation Δθ in a rotation direction of the electronic component 30 and by correcting a positioning deviation Δθ with rotation of the nozzle 22 at very small angle while transferred to the substrate 3. The setting of the packaging angle makes it possible to eliminate the positioning deviation in a horizontal rotation direction caused by a large angle rotation of the electronic component 30 and mount the electronic component 30 on the substrate 3 with an accurate positioning and at a high speed. |
