发明名称 PRECURSOR POLYMER COMPOSITION AND LOW DIELECTRIC CONSTANT INSULATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an insulating material exhibiting heat resistance, specific dielectric constant and O2 -plasma resistance suitable for producing interlaminar insulating films, and to provide its precursor. SOLUTION: This precursor polymer composition comprises a polyorgnosiloxazane containing the formulas: (RSiN3 ), (RSiN2 O, (RSiNO2 ) and (RSiO3 ) (R is an alkyl, an alkenyl, a cycloalkyl, an aryl, an alkylamino or an alkylsilyl) as main repeating units and having a number-average mol.wt. of 400-100,000, and a polyorganosilazane or perhydropolysilazane in an amount of 1-50 wt.% based on the polyorganosiloxazane. The insulating material is obtained by baking the composition.
申请公布号 JPH1160957(A) 申请公布日期 1999.03.05
申请号 JP19970225118 申请日期 1997.08.21
申请人 TONEN CORP 发明人 TASHIRO YUJI;FUNAYAMA TORU
分类号 C08L83/14 主分类号 C08L83/14
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