| 摘要 |
PROBLEM TO BE SOLVED: To measure position and height of a to-be-inspected object quickly with precision. SOLUTION: A CCD camera 16 for imaging the image of the surface of a CS(chip size) package 53 which is a to-be-inspected object, an image processing device 24 wherein, based on the image taken with the CCD camera 16. the position of a projection (solder ball) on the surface of to-be-inspected object is calculated, a sensor 12 for detecting the height of the projection on the surface of to-be-inspected object, and a sensor position setting device 22 and a drive device 20 which, according to the position of projection calculated with the image processing device 24, moves the sensor 12 to the position of projection on the surface of to-be-inspected object, are provided. |
