发明名称 SILICON CARBIDE SUBSTRATE, PROCESS FOR PRODUCING THE SAME, AND SEMICONDUCTOR ELEMENT CONTAINING SILICON CARBIDE SUBSTRATE
摘要 A thin silicon carbide film is epitaxially grown by MBE etc. on the silicon carbide crystal growth surface (1a) of a substrate (1) while keeping silicon atoms (2) present in excess relative to carbon atoms. Thus, a silicon carbide substrate with a satisfactory crystalline state can be formed at a low temperature with good reproducibility. This growth is possible even at temperatures not higher than 1300 DEG C, and it is possible to form a heavily doped film, a selectively grown film, and a film comprising cubic silicon carbide grown over hexagonal crystals. When cubic silicon carbide is crystallized on hexagonal crystals, the use of an off-cut substrate having a plane slanting to the direction (numeral 1) is effective in preventing twin generation.
申请公布号 WO9910919(A1) 申请公布日期 1999.03.04
申请号 WO1998JP03826 申请日期 1998.08.27
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KITABATAKE, MAKOTO;UCHIDA, MASAO;TAKAHASHI, KUNIMASA 发明人 KITABATAKE, MAKOTO;UCHIDA, MASAO;TAKAHASHI, KUNIMASA
分类号 H01L21/205;C30B23/02;H01L21/04;H01L21/20;H01L21/203;H01L29/04;H01L29/10;H01L29/24;H01L29/80 主分类号 H01L21/205
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