发明名称 |
SILICON CARBIDE SUBSTRATE, PROCESS FOR PRODUCING THE SAME, AND SEMICONDUCTOR ELEMENT CONTAINING SILICON CARBIDE SUBSTRATE |
摘要 |
A thin silicon carbide film is epitaxially grown by MBE etc. on the silicon carbide crystal growth surface (1a) of a substrate (1) while keeping silicon atoms (2) present in excess relative to carbon atoms. Thus, a silicon carbide substrate with a satisfactory crystalline state can be formed at a low temperature with good reproducibility. This growth is possible even at temperatures not higher than 1300 DEG C, and it is possible to form a heavily doped film, a selectively grown film, and a film comprising cubic silicon carbide grown over hexagonal crystals. When cubic silicon carbide is crystallized on hexagonal crystals, the use of an off-cut substrate having a plane slanting to the direction (numeral 1) is effective in preventing twin generation. |
申请公布号 |
WO9910919(A1) |
申请公布日期 |
1999.03.04 |
申请号 |
WO1998JP03826 |
申请日期 |
1998.08.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KITABATAKE, MAKOTO;UCHIDA, MASAO;TAKAHASHI, KUNIMASA |
发明人 |
KITABATAKE, MAKOTO;UCHIDA, MASAO;TAKAHASHI, KUNIMASA |
分类号 |
H01L21/205;C30B23/02;H01L21/04;H01L21/20;H01L21/203;H01L29/04;H01L29/10;H01L29/24;H01L29/80 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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