| 摘要 |
A polishing pad is provided for chemical-mechanical polishing widely used in the semiconductor industry. The pad material is hexagonal boron nitride and its composite. The pad is in the shape of a disc, a ring, or any plate having one or more openings. The pad can have a configuration of either two layers or three layers. The abrasive particles may be or may not be added in the pad materials. The high modulus of the pad leads to a high planarization within a die. The flexible design of the pad leads to a high polishing uniformity within a wafer surface. |
