VORRICHTUNG MIT OBERFLÄCHENMONTIERTEN BAUTEILEN TRAGENDEN INNENSCHICHTEN
摘要
A semiconductor die package (30) includes a plurality of conductive leads (11) and a multi-layer structure (10) for carrying electrical signals, the multi-layer structure (10) including a plurality of layers of insulative material (12a-12d), each of the layers including a first surface and a second surface on an opposing side of the layer. Each of the leads (11) extends into a corresponding well (15) extending completely through at least one of the layers and bottoming at one of the surfaces of one of the layers through which the well (15) does not extend and is electrically coupled to an electrically conductive bonding structure (13) formed within its corresponding well (15). <IMAGE>
申请公布号
DE69507459(D1)
申请公布日期
1999.03.04
申请号
DE1995607459
申请日期
1995.03.09
申请人
THE PANDA PROJECT, BOCA RATON, FLA., US
发明人
CRANE, STANFORD, W., JR., BOCA RATON, FL 33496, US;PORTUONDO, MARIA, M., BOCA RATON, FL 33432, US