| 摘要 |
Apparatus for sputtering magnetic target material using a magnetic field shunt within a moving magnet sputtering source. The apparatus includes a magnetic field shunt that is embedded into the target material along the path of the moving magnet assembly at a location where a deep erosion trench is created by the assembly in the target material. The magnetic field shunt provides an alternate path for the magnetic flux that is liberated by the erosion of the target. Alternatively, the magnetic field shunt is physically attached to the magnetic pole piece such that the magnetic shunt moves with the pole piece along the track that the pole piece is moved.
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