发明名称 DIE ATTACH RESIN PASTE FOR SEMICONDUCTOR
摘要 <p>PROBLEM TO BE SOLVED: To obtain a resin paste excellent in low staining properties by including a urethane acrylate resin or a urethane methacrylate resin, an acrylic resin or a methacrylic resin, an organic peroxide and an inorganic filler in a specified ratio. SOLUTION: This paste contains 100 pts.wt. urethane acrylate resin or urethane methacrylate resin represented by formula I or II, 50-200 pts.wt. acrylic resin or methacrylic resin represented by formula III, 0.1-50 pts.wt. organic peroxide such as 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate and 50-1,200 pts.wt. inorganic filler (e.g. silica) having a particle diameter of 50μm or below. The urethane acrylate resin or the like has low elasticity and is obtained by reacting a reaction product of polypropylene glycol with isophorone diisocyanate with hydroxyethyl acrylate or the like. In the formulae, R1 and R2 are each CH3 or H; and (m) and (n) are integers.</p>
申请公布号 JPH1160654(A) 申请公布日期 1999.03.02
申请号 JP19970222215 申请日期 1997.08.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 KAGIMOTO TOMOHIRO;MURAYAMA RYUICHI;TAKEDA TOSHIRO
分类号 C08K3/00;C08F290/06;C08K5/14;C08L75/16;C09J175/16;H01L21/52;(IPC1-7):C08F290/06 主分类号 C08K3/00
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