| 摘要 |
A semiconductor substrate made of silicon or the like and having an active region is used as part of a package. Bumps are formed on a major surface of the semiconductor substrate. One end of each lead is connected to a corresponding bump, and the other end of the lead is located outside the major surface of the semiconductor substrate. An adhesive such as a thermoplastic resin is applied to the major surface of the semiconductor substrate. An upper substrate is located on the adhesive. The upper substrate is made of a metal plate, an insulating plate, or a semiconductor substrate. The upper substrate covers at least the active region of the semiconductor substrate, the bumps, and the lead portions on the semiconductor substrate.
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