发明名称 |
Encapsulated semiconductor device and electronic circuit board mounting same |
摘要 |
A semiconductor device has a resin package containing a semiconductor chip, lead pins electrically connected to the chip, and a heat radiating plate for transmitting heat of the semiconductor chip to the exterior. The lead pins and the heat radiating plate protrude from a side wall of the resin package. The lead pins each have a planar end part attached by soldering to a wiring pattern on a circuit board. The heat radiating plate has a planar attachment part which is attached by soldering to a heat radiating pattern on the circuit board. The planar attachment part of the heat radiating plate is non-rectangular and is shaped such that when it is attached to a solder-coated area on a heat radiating pattern formed on a circuit board, the melted solder is more effectively prevented from flowing out. |
申请公布号 |
US5877937(A) |
申请公布日期 |
1999.03.02 |
申请号 |
US19960773699 |
申请日期 |
1996.12.27 |
申请人 |
ROHM CO., LTD. |
发明人 |
SHIBATA, KAZUTAKA;HORIO, TOMOHARU |
分类号 |
H01L23/28;H01L23/495;H01L23/50;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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