| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a jig for supporting wafers and a heat-treating apparatus using the same, which has a relatively simple structure at a low cost, and wherein for troubles occur, when carrying the wafers and the occurrence of slip can be protected during a heat treatment with semiconductor wafers of large diameter carried on the jig. SOLUTION: A heat-treating apparatus is a vertical boat comprising a plurality of jigs for horizontally supporting a silicon wafer in heat-treating the silicon wafer, and a plurality of jigs 3 for supporting the wafer arranged respectively, in response to braces 2 provided between a couple of top boards consisting of quartz, silicon and so on which have high heat resistance, high anticorrosion property, high purity, high working accuracy, with a thermal expansion coefficient which is as high as that of the silicon wafer 5, and the stiffness coefficient smaller than that of the silicon wafer 5. Supporting portions 4 at the ends are arranged at three points in a range of 0.55 to 0.95 times the radius of the silicon wafer 5 from the center, so that a load on the silicon wafer 5 can be distributed most uniformly and stress due to self-weight can be reduced.</p> |
