RETICLE AND PATTERN TRANSFERRED BY THE SAME AS WELL AS METHOD FOR ALIGNING RETICLE AND SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a reticle which allows exact alignment and patterns formed by the same as well as a method for alignment. SOLUTION: A wafer processing device 20 transfers a first reticle mask 7 to a wafer 48 (S31). Deviations are measured with each of Box-in-Box marks 104 formed at four corners of the respective shot regions on the wafer 48 (S32). The error parameters for the alignment are calculated from the amount of misposition (S33). The error parameters are corrected in accordance with the correction value previously calculated by using the Box-in-Box marks 104 (S34). The alignment of a wafer stage 52 is executed in accordance with the error parameters after the correction (S35) and thereafter the second reticle mask 94 is transferred to the wafer 48 (S36).