| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment device and a treatment method with enable a liquid film of dense treatment liquid to be formed uniformly on a surface of a substrate, without inclusion of bubbles before vibration is damped. SOLUTION: A treatment device 7 is constituted so as to have a spin chuck 10 for rotatively holding a wafer W, a supply means 20 for supplying treatment liquid to a surface of the wafer W held by the spin chuck 10, and a vibrator 23 for applying vibration to a treatment liquid. The vibrator 23 is constituted to cover a surface of the wafer W held by the spin chick 10 from almost the center thereof to an arbitrary circumferential edge part and is arranged in a place far from the surface of the wafer W inside a liquid film of the treatment liquid supplied to the surface of the wafer W.
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