| 摘要 |
PROBLEM TO BE SOLVED: To provide the form of a lead frame which prevents burrs from sticking to the part from the central part to the vicinity of tip of an outer lead which burrs are generated in the resin sealing process of a semiconductor package. SOLUTION: A recessed burr stopper 10a having a depth of 1-50μm is formed on the mold outer shape side of an outer lead 5 surface except a tie bar 4. The burr stopper 10a stores sealing resin which leaks from a slight gap between a lead frame and a sealing metal mold 7, thereby stopping burrs 9 in the vicinity of the mold outer shape. It is prevented that the burr 9 sticks to the part from the vicinity of the central part to the vicinity of a tip of the outer lead which participates the bonding when a resin sealed semiconductor package is manufactured and then mounted on a printed board. As a result, solder plating of tin or tin-lead is enabled without a burr eliminating process, and reduction of the manufacturing cost and improvement of productivity are realized. |
