| 摘要 |
PROBLEM TO BE SOLVED: To prevent a multilayered printed board from being influenced by the shapes and distribution of inner-layer conductors, by boring a hole through an adhesive insulating layer in advance in accordance with the area of a circuit conductor formed on the surface of an inner circuit board. SOLUTION: Inner-layer wiring boards 4 and 5 are respectively laminated upon both surfaces of an inner-layer wiring board 2 and adhesive insulating layer 6 and copper foil 7 are successively laminated upon the wiring boards 4 and 5. A glass cloth prepreg impregnated in a polyimide resin having holes of 0.36 mm in diameter and drilled through the prepreg in a 1-mm grid is used for the insulating layers 4 and 5. Then, a laminated board 8 is formed by integrating the laminated body by heating and pressurizing the laminated body between end plates, and a hole 9 is drilled as a through hole. Therefore, a multilayered printed board which is not influenced by the shapes and distribution of inner layer circuit conductors can be manufactured. |
